ECP Series Automatic Wafer ( Horizontal ) Plating Machine

(1) Application fields: Pillar,Bump,RDL,TSV and other processes

(2) Wafer size: 150mm&200mm&300mm (customizable)

(3) Process index: high uniformity: WiW≤3%, WtW≤3%, RtR≤3%

Inquire Now Next Product

Product Overview

PCB Horizontal Plating Machine: Advanced Automatic Wafer (Horizontal) Plating Machine Solutions

The Automatic Wafer (Horizontal) Plating Machine by JuYongNeng—a cutting-edge system engineered to deliver high-precision metal deposition on wafers for advanced semiconductor and microelectronics manufacturing. As a leading provider in the industry and a recognized Horizontal Wafer Coating Machine Manufacturer, we ensure optimal performance from start to finish.

The ECP Series Automatic Wafer (Horizontal) Plating Machine is designed for applications including Pillar, Bump, Redistribution Layer (RDL), and Through-Silicon Via (TSV) processes. Supporting wafer sizes of 150mm, 200mm, and 300mm, this machine guarantees exceptional uniformity and repeatability, making it a versatile solution for next-generation semiconductor fabrication.

ECP Series Automatic Wafer (Horizontal) Plating Equipment

Technical Parameter Table

Parameter	Specification
Wafer Size	150mm, 200mm, 300mm (customizable)
Uniformity	WiW ≤3%, WtW ≤3%, RtR ≤3%
Plating Materials	Cu, Ni, Au, Sn, Ag
Load Ports	3
Plating Cavities	Up to 8 (customizable)
Pre-treatment Cavities	2
Cleaning/Drying Chambers	2 each
Control System	Industrial IoT + SECS/GEM protocol
Manipulator	Japanese dual-arm robotic system
Communication	SECS/GEM protocol for factory automation

Key Features

High Uniformity Performance: Achieves within-wafer (WiW), wafer-to-wafer (WtW), and run-to-run (RtR) consistency at ≤3%, ensuring reliable plating quality across all wafers.
Horizontal Plating Chamber: The innovative design eliminates cross-contamination risks while enhancing process stability.
Automated Handling System: Equipped with a dual-arm wafer manipulator imported from Japan, it ensures fast, precise, and stable wafer transfer.
Modular Configuration: Configurable with 8 plating cavities, 2 prepreg cavities, 2 cleaning chambers, and 2 drying chambers for flexible process integration.
Smart Control System: Features an industrial touch-screen interface with genuine IoT software and SECS/GEM protocol support for seamless smart factory integration.
Automatic Chemical Management: Integrated dosing system minimizes chemical waste and downtime, further optimizing efficiency.
Robust Construction: Industrial-grade components ensure durability and reliable 24/7 operation.

Applications & Industry Impact

This Automatic Wafer (Horizontal) Plating Machine is ideally suited for advanced packaging and high-current power device applications, as well as MEMS, sensor fabrication, and optoelectronics. It provides precise metal deposition (Cu, Ni, Au, Sn, Ag) for critical processes and enhances overall manufacturing productivity.

Service & Support

JuYongNeng offers comprehensive after-sales support including on-site installation, operator training, and 24/7 technical assistance via global hotlines and remote diagnostics. Preventive maintenance programs and a dedicated spare parts inventory ensure minimal downtime and maximum ROI.

Why Choose JuYongNeng?

With over 15 years of expertise in semiconductor equipment and advanced manufacturing processes, JuYongNeng is recognized globally for excellence. Our investment in continuous R&D and commitment to innovation positions our Automatic Wafer (Horizontal) Plating Machine as a leader in precision metal deposition. By meeting international standards for semiconductor manufacturing, our solutions optimize productivity and quality, setting a benchmark for the industry.

As a premier PCB Horizontal Plating Machine provider, JuYongNeng's Automatic Wafer (Horizontal) Plating Machine delivers unparalleled accuracy, efficiency, and process stability for advanced semiconductor fabrication. Trust our expert team and comprehensive support to deliver an Automatic Wafer (Horizontal) Plating Machine that meets your most rigorous manufacturing demands.